IDT71V67602, IDT71V67802, 256K x 36, 512K x 18, 3.3V Synchronous
SRAMs with 2.5V I/O, Pipelined Outputs, Single Cycle Deselect
Commercial and Industrial Temperature Ranges
Absolute Maximum Ratings (1)
Symbol Rating Commercial
Unit
Recommended Operating
Temperature and Supply Voltage
V TERM
(2)
Terminal Voltage with
-0.5 to +4.6
V
Grade
Temperature (1)
V SS
V DD
V DDQ
Respect to GND
Commercial
0°C to +70°C
0V
3.3V±5%
2.5V±5%
V TERM (3,6)
Terminal Voltage with
Respect to GND
-0.5 to V DD
V
Industrial
-40°C to +85°C
0V
3.3V±5%
2.5V±5%
V TERM (4,6)
V TERM (5,6)
Terminal Voltage with
Respect to GND
Terminal Voltage with
Respect to GND
-0.5 to V DD +0.5
-0.5 to V DDQ +0.5
V
V
NOTE:
1. T A is the "instant on" case temperature.
Recommended DC Operating
Conditions
5311 tbl 04
T A (7)
T BIAS
T STG
Commercial
Industrial
Temperature
Under Bias
Storage
-0 to +70
-40 to +85
-55 to +125
-55 to +125
o
o
o
o
C
C
C
C
Symbol
V DD
V DDQ
V SS
Parameter
Core Supply Voltage
I/O Supply Voltage
Ground
Min.
3.135
2.375
0
Typ.
3.3
2.5
0
Max.
3.465
2.625
0
Unit
V
V
V
Temperature
V IH
Input High Voltage - Inputs
1.7
____
V DD +0.3
V
-0.3
P T
I OUT
Power Dissipation
DC Output Current
2.0
50
W
mA
V IH
V IL
Input High Voltage - I/O
Input Low Voltage
1.7
(1)
____
____
V DDQ +0.3
0.7
V
V
5311 tbl 03
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. V DD terminals only.
3. V DDQ terminals only.
4. Input terminals only.
5. I/O terminals only.
6. This is a steady-state DC parameter that applies after the power supplies have
ramped up. Power supply sequencing is not necessary; however, the voltage
on any input or I/O pin cannot exceed V DDQ during power supply ramp up.
7. T A is the "instant on" case temperature.
100-pin TQFP Capacitance
(T A = +25°C, f = 1.0MHz)
NOTE:
1. V IL (min) = -1.0V for pulse width less than t CYC/2 , once per cycle.
165 fBGA Capacitance
(T A = +25°C, f = 1.0MHz)
5311 tbl 06
Symbol
Parameter
(1)
Conditions
Max.
Unit
Symbol
Parameter (1)
Conditions
Max.
Unit
C IN
C I/O
Input Capacitance
I/O Capacitance
V IN = 3dV
V OUT = 3dV
5
7
pF
pF
C IN
C I/O
Input Capacitance
I/O Capacitance
V IN = 3dV
V OUT = 3dV
7
7
pF
pF
119 BGA Capacitance
(T A = +25°C, f = 1.0MHz)
5311 tbl 07
5311 tbl 07b
Symbol
C IN
C I/O
Parameter (1)
Input Capacitance
I/O Capacitance
Conditions
V IN = 3dV
V OUT = 3dV
Max.
7
7
Unit
pF
pF
5311 tbl 07a
NOTE:
1. This parameter is guaranteed by device characterization, but not production tested.
6.42
相关PDF资料
IDT71V67603S166PFGI IC SRAM 9MBIT 166MHZ 100TQFP
IDT71V67703S85BGGI IC SRAM 9MBIT 85NS 119BGA
IFMD18105 CABINET STEEL 19.6X39.4X77.3 BEI
IFMD18106 CABINET STEEL 23.6X39.4X77.3 BEI
IFMD18108 CABINET STEEL 31.5X39.4X77.3 BEI
IFMD1885 CABINET STEEL 19.6X31.5X77.3 BEI
IFMD1886 CABINET STEEL 23.6X31.5X77.3 BEI
IFMD1888 CABINET STEEL 31.5X31.5X77.3 BEI
相关代理商/技术参数
IDT71V67602S166BGG8 功能描述:IC SRAM 9MBIT 166MHZ 119BGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V67602S166BQ 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQ8 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQG 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQG8 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQGI 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQGI8 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
IDT71V67602S166BQI 功能描述:IC SRAM 9MBIT 166MHZ 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M(64M x 8) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040